2019 07 Advanced Materials Interfaces

Observation and Implications of Composition Inhomogeneity Along Grain Boundaries in Thin Film Polycrystalline CdTe Photovoltaic Devices“, S. Misra1, J. A. Aguiar2, Y. Sun3, B. V. Devener2, V. Palekis4, C. S. Ferekides4, H. P. Yoon1, P. Bermel3, M. A. Scarpulla1, Advanced Materials Interfaces 1900152, 2019.

1. Electrical and Computer Engineering, University of Utah, Salt Lake City, UT 84102, USA
2. Nuclear Materials Department, Idaho National Laboratory, Idaho Falls, ID 83415, USA
3. Electrical and Computer Engineering, Purdue University, West Lafayette, IN 47906, USA
4. Electrical Engineering, University of South Florida, Tampa, FL 33620, USA

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2019 07 Electronic Materials Conference

Yoon’s group presented two research projects at the 61st Electronic Materials Conference  (June 26 ~ June 28, 2019; University of Michigan, Ann Arbor, MI)

Impact of Ar Ion Beam Milling on Surface Properties of Polycrystalline CdTe Solar Cells (David Magginetti, Seokmin Jeon, Yohan Yoon, Erfan Pourshaban, and Heayoung Yoon)
1. Materials Science and Engineering, University of Utah, Salt Lake City, UT 84112, USA
2. U.S. Naval Research Laboratory, Washington, DC 20375, USA
3. Electrical and Computer Engineering, University of Utah, Salt Lake City, UT 84112, USA

Surface Potential Imaging of High-Aspect-Ratio Si Microwires Fabricated by Metal-assisted Chemical Etching Process (Erfan Pourshaban, Seokmin Jeon, Yohan Yoon, David Magginetti, and Heayoung Yoon)
1. Electrical and Computer Engineering, University of Utah, Salt Lake City, UT 84112, USA
2. U.S. Naval Research Laboratory, Washington, DC 20375, USA
3. Materials Science and Engineering, University of Utah, Salt Lake City, UT 84112, USA

2019 05 Advanced Materials Interfaces

Water‐Assisted Liftoff of Polycrystalline CdS/CdTe Thin Films Using Heterogeneous Interfacial Engineering“, D. Magginetti1, J. Aguiar1,2, J. Winger1, M. Scarpulla1,3, E. Pourshaban2, H. Yoon1,3, Advanced Materials Interfaces 1900300, 2019.

1. Materials Science and Engineering, University of Utah, Salt Lake City, UT 84102, USA
2. Nuclear Materials Department, Idaho National Laboratory, Idaho Falls, ID 83415, USA
3. Electrical and Computer Engineering, University of Utah, Salt Lake City, UT 84102, USA

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2019 04 I would say… (Technical Open-House)

Every year, the ECE Department organizes the Technical Open-House (see details) for undergraduate students. Dr. Yoon encourages students in her class (ECE 3200: Introduction to Semiconductor Device Physics) to attend this exciting event. Here are some reviews from the students attending the Technical Open-House this year.

 

The presenters were knowledgeable, confident, and concise. Their use of a large screen to step through the presentation provided clarity and good flow. I appreciated that they took the time to understand the level of understanding their audience would have and broke down highly technical items into bite-sized pieces of information

(taken/described by Todd Renner)

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