2019 12 ACS Applied Materials & Interfaces

Our Collaborative work with NIST and NRL is presented in an ACS paper.

“Unveiling Defect-Mediated Charge-Carrier Recombination at the Nanometer Scale in Polycrystalline Solar Cells”, Yohan Yoon, Wei-Chang D. Yang*, Dongheon Ha, Paul M. Haney, Daniel Hirsch, Heayoung P. Yoon, Renu Sharma, and Nikolai B. Zhitenev, ACS Appl. Mater. Interfaces 2019, 11, 50, 47037–47046 (2019); https://pubs.acs.org/doi/full/10.1021/acsami.9b14730

 

2019 07 Advanced Materials Interfaces

Observation and Implications of Composition Inhomogeneity Along Grain Boundaries in Thin Film Polycrystalline CdTe Photovoltaic Devices“, S. Misra1, J. A. Aguiar2, Y. Sun3, B. V. Devener2, V. Palekis4, C. S. Ferekides4, H. P. Yoon1, P. Bermel3, M. A. Scarpulla1, Advanced Materials Interfaces 1900152, 2019.

1. Electrical and Computer Engineering, University of Utah, Salt Lake City, UT 84102, USA
2. Nuclear Materials Department, Idaho National Laboratory, Idaho Falls, ID 83415, USA
3. Electrical and Computer Engineering, Purdue University, West Lafayette, IN 47906, USA
4. Electrical Engineering, University of South Florida, Tampa, FL 33620, USA

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2019 07 Electronic Materials Conference

Yoon’s group presented two research projects at the 61st Electronic Materials Conference  (June 26 ~ June 28, 2019; University of Michigan, Ann Arbor, MI)

Impact of Ar Ion Beam Milling on Surface Properties of Polycrystalline CdTe Solar Cells (David Magginetti, Seokmin Jeon, Yohan Yoon, Erfan Pourshaban, and Heayoung Yoon)
1. Materials Science and Engineering, University of Utah, Salt Lake City, UT 84112, USA
2. U.S. Naval Research Laboratory, Washington, DC 20375, USA
3. Electrical and Computer Engineering, University of Utah, Salt Lake City, UT 84112, USA

Surface Potential Imaging of High-Aspect-Ratio Si Microwires Fabricated by Metal-assisted Chemical Etching Process (Erfan Pourshaban, Seokmin Jeon, Yohan Yoon, David Magginetti, and Heayoung Yoon)
1. Electrical and Computer Engineering, University of Utah, Salt Lake City, UT 84112, USA
2. U.S. Naval Research Laboratory, Washington, DC 20375, USA
3. Materials Science and Engineering, University of Utah, Salt Lake City, UT 84112, USA

2019 05 Advanced Materials Interfaces

Water‐Assisted Liftoff of Polycrystalline CdS/CdTe Thin Films Using Heterogeneous Interfacial Engineering“, D. Magginetti1, J. Aguiar1,2, J. Winger1, M. Scarpulla1,3, E. Pourshaban2, H. Yoon1,3, Advanced Materials Interfaces 1900300, 2019.

1. Materials Science and Engineering, University of Utah, Salt Lake City, UT 84102, USA
2. Nuclear Materials Department, Idaho National Laboratory, Idaho Falls, ID 83415, USA
3. Electrical and Computer Engineering, University of Utah, Salt Lake City, UT 84102, USA

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2018 07 Electronic Materials Conference

Yoon’s group presented two research projects at the 60th EMC conference (June 27 ~ June 29, 2018; University of California, Santa Barbara, CA)

♦ Large-area MoTe2 Film Growth Using High-Vacuum Ampoule Process (David Magginetti, Xueling Cheng, Prashanth Gopalan, BerardiSensale-Rodriguez, and Heayoung Yoon)

♦ Local Photovoltage / NSOM Imaging of ZnTe/CdTe Back Contact (Yohan Yoon, David Magginetti, Erfan Pourshaban, Vasilios Palekis, Chih An Hsu, Mike Scarpulla, Chris Ferekides, and Heayoung Yoon)

2017 Nanoscale

Wide-spectral/dynamic-range skin-compatible phototransistors enabled by floated heterojunction structures with surface functionalized SWCNTs and amorphous oxide semiconductors“, I. Hwang1, J. Kim1, M. Lee2, M. Lee1, H. Kim1, H. Kwon1, D. Hwang3, M. Kim4, H. Yoon5, Y. Kim2, and S. Park1, Nanoscale 9, 16711, 2017.

1. School of Electrical and Electronics Engineering, Chung-Ang University, Seoul 06974, Korea
2. School of Advanced Materials Science and Engineering and SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon, Korea
3. Center for Opto-Electronic Materials and Devices, Post-Silicon Semiconductor Institute, Korea Institute of Science and Technology (KIST), Seoul, Korea
4. Department of Chemistry, Chung-Ang University, Seoul, Korea
5. Department of Electrical and Computer Engineering, University of Utah, Salt Lake City, USA
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